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瀏覽器自帶分享功能也很好用哦~Wafer thinning
Backside Clean
Liftoff/PR Stripper
Pre Clean
Post clean
BS Clean
NiPt Removal
Application(應用)
Metal Etching, DSP+ Liquid Film PR Stripper Backside Etching
Thin Wafer Etching with Bernoulli Chuck
Performance(工藝）
PA adder, <10ea @ 0.2um u% <3% of metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(競爭優勢)
>97% Chemical Recycle Rate Max 4 chemicals in one chamber
Modularized Platform for 200/300mm Wafer
Safety(安全）
Semi S2/S6/F47 Certification
FM approval material and CO2 fire extinguisher Interlock Matrix Control
Application(應用)
Metal Etching, DSP+ Liquid Film PR Stripper Backside Etching
Thin Wafer Etching with Bernoulli Chuck
Performance(工藝）
PA adder, <10ea @ 0.2um u% <3% of metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(競爭優勢)
>97% Chemical Recycle Rate Max 4 chemicals in one chamber
Modularized Platform for 200/300mm Wafer
Safety(安全）
Semi S2/S6/F47 Certification
FM approval material and CO2 fire extinguisher Interlock Matrix Control
ONLINE MESSAGE
RELATED PRODUCTS
滬ICP備2022032879號-1